Automotive Column-Mounted Shifter FPC

This automotive shifter flexible circuit board uses high-temperature-resistant PI coverlay to enhance tensile strength while maintaining excellent flexural durability—effectively preventing assembly tearing. After nearly one year of R&D and validation, Hongyi Precision has launched two thickness options: 0.025 mm and 0.05 mm. The material exhibits outstanding performance across wide temperature ranges, resisting low-temperature embrittlement and high-temperature softening/deformation. It offers strong adhesion and resists lifting or cracking after repeated flexing—ideal for long-term stable operation in automotive rotary sensing mechanisms.

Automotive Column-Mounted Shifter FPC

Key features

High-Temperature-Resistant PI Coverlay

Dual optimization of flexural durability and tensile strength to prevent assembly tearing

Two coverlay thickness options available

0.025 mm and 0.05 mm thickness options provided

Wide-Temperature Stability

Mitigates risks of low-temperature embrittlement and high-temperature softening/deformation

Strong coverlay adhesion

Resists lifting or delamination/cracking under repeated flexing

Precision trace fabrication

Ensures continuous, stable angular sensing signal output

100% electrical full inspection

Strict control of batch-to-batch quality consistency

Specifications

Layers
1–2 layers
Minimum trace width/spacing
60/60 μm
Base material
PI 12.5 μm / 25 μm
Copper thickness
12 μm, 18 μm
Coverlay
High-temperature-resistant PI film, 0.025 mm / 0.05 mm optional
Surface finish
ENIG gold plating, OSP
Operating temperature
–40 °C to 105 °C
Electrical testing
100% full inspection

Typical applications

  • Automotive angular position sensor
  • Automotive electronic shifter sensing module
  • Steering angle detection assembly
  • Signal flex cable for automotive rotary mechanisms

Talk to an engineer

Share your Gerber files or specification and our engineering team will assess manufacturability, advise on process and stack-up, then move your project through sampling and volume production to automotive standards.

Quote Now

Related reading

Industry Insights

How Automotive FPC Suppliers Support Project Launch: Key Milestones from Quotation to PPAP

From quotation to mass production, automotive electronic FPC development involves requirement clarification, DFM, prototype build, design validation, process validation, and PPAP. A supplier’s ability to deliver correct documentation and close risks at each stage directly impacts project timeline. This article outlines the project launch responsibilities of automotive electronic FPC suppliers.

Learn more
Industry Insights

How to Conduct Reliability Validation for Automotive Electronic FPCs: Correlating Lab Tests with Real Vehicle Operating Conditions

Reliability validation of automotive electronic FPCs cannot rely solely on a single pass in the lab. Temperature cycling, vibration, bending, damp heat, and post-assembly electrical performance must all correlate with actual vehicle mounting locations and operating conditions. This article maps common validation tests to field failure risks—helping customers develop more effective validation plans for automotive flexible circuit boards.

Learn more
Industry Insights

What to Review in DFM for Automotive FPCs: A Risk Checklist from Drawing to First Article

The most valuable step before mass production of automotive FPCs is DFM review. Proactively verifying materials, stack-up, trace width/spacing, flex zones, pads, connectors, and test points—before tooling and trial runs—uncovers the majority of high-cost risks. This article presents a first-article review framework tailored for automotive projects.

Learn more