Custom 0.15/0.2mm Ultra-Thin FR4 PCB
Specialized in 0.15mm and 0.2mm ultra-thin FR4 rigid PCB production, overcoming thin-board lamination warpage via dedicated thin-board production lines. High-Tg substrates available; IATF 16949 automotive qualification supported. Widely applied in automotive electronics and intelligent modules. Engineering pre-assessment supported, with prototyping, low-to-medium volume, and high-volume production delivery.
Key features
Ultra-Thin Finished Thickness
Supports finished thicknesses down to 0.15mm (ultra-limit thin board) and 0.2mm ultra-thin FR4 rigid boards, optimized for space-constrained miniature module designs.
Warpage-Specific Control
Employs vacuum lamination, thin-board-specific fixtures, and optimized stack-up design to effectively reduce warpage after lamination and reflow soldering, meeting SMT continuous placement requirements.
High-Reliability Substrate Options
Standard FR4 or high-Tg FR4 (TG ≥170°C), offering strong thermal shock resistance for high-temperature automotive environments.
Automotive-Grade Quality Capability
Production controlled per IATF 16949 requirements, with full traceability across incoming materials, process steps, and reliability testing—targeted for high-end applications including automotive electronics and AI intelligent modules.
Fine-Line Capability
LDI direct imaging enables fine line width/spacing; supports blind/buried via HDI stack-up design.
End-to-End Delivery
Supports early-stage engineering stack-up evaluation, prototyping, low-to-medium volume, and stable high-volume production—with proactive thin-board risk assessment.
Specifications
- Layer Count
- 1–2 layers (0.15mm layer count subject to stack-up evaluation)
- Finished Board Thickness
- 0.15mm / 0.2mm
- Copper Foil Thickness
- 12μm / 18μm / 25μm options available
- Base Material
- FR-4; high-Tg options: TG170°C / TG180°C
- Minimum Line Width / Spacing
- Standard 0.05mm (LDI process; subject to board thickness and layer evaluation)
- Minimum Drilled Hole Diameter
- Mechanical drill ≥0.15mm; laser blind vias ≥0.08mm (HDI)
Typical applications
- Automotive Electronics
- AI Robot Modules
- Miniature Sensors
- Slim Industrial Control Modules
Talk to an engineer
Share your Gerber files or specification and our engineering team will assess manufacturability, advise on process and stack-up, then move your project through sampling and volume production to automotive standards.
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